Описание
Practical LED Packaging Technology
Артикул Маркета
6053134804
Внешний вид товаров и/или упаковки может быть изменён изготовителем и отличаться от изображенных на Яндекс Маркете.
1 565 ₽
2 690 ₽
–42%
1 565 ₽
2 690 ₽
–42%
Доставка Маркета
15 окт, по клику 0 ₽
Москва
15 окт, пункт выдачи 0 ₽
Москва
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Т8 Издательские Технологии
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Описание
Печатная книга «Practical LED Packaging Technology» в мягкой обложке, язык - английский. В книге 276 страниц, она напечатана на белой офсетной бумаге плотностью 80 г/м². Формат издания — 152x229 мм. Все книги аккуратно упаковываем в прочный трёхслойный непрозрачный картонный конверт.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.
This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.
Характеристики
Артикул Маркета
6053134804
Внешний вид товаров и/или упаковки может быть изменён изготовителем и отличаться от изображенных на Яндекс Маркете.Возрастное ограничение 18+
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